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High Solid Content Matting Flux
产品概要:
-High solid content no-clean flux with matte solder joints, which effectively avoids visual fatigue during inspection.
-Smooth and dry PCB surface after soldering, non-sticky, with strong universality.
-Excellent solderability, especially for complex and dense components.
-Passes strict copper mirror test, copper plate corrosion test and surface insulation resistance (SIR) test, safe and reliable.
-High temperature resistance, enabling lead-free solder to wet and spread rapidly with full solder joints and good penetration, effectively preventing short circuits.
-Smooth and dry PCB surface after soldering, non-sticky, with strong universality.
-Excellent solderability, especially for complex and dense components.
-Passes strict copper mirror test, copper plate corrosion test and surface insulation resistance (SIR) test, safe and reliable.
-High temperature resistance, enabling lead-free solder to wet and spread rapidly with full solder joints and good penetration, effectively preventing short circuits.
E-mail：
sunhot@gdsunhot.com
Fluxes help and facilitate the soldering process while providing protection against oxidation of chemicals. Sunhot flux is carefully formulated with imported film forming agent, high-efficiency active agent and organic activator, and has a large range of selectable process parameters, so that it can adapt to different environments, different equipment and different process conditions, and has excellent performance in the application fields of spray or foaming wave soldering and manual dip soldering. At the same time, the circuit board after soldering the flux has a high surface insulation resistance, which can ensure the safety and reliability of the electrical performance of the circuit board.
1. Product introduction
The company's high-solids matting flux is carefully formulated with imported film forming agent, high-efficiency active agent and organic activator, which is extremely applicable and has excellent performance in the application fields of spray or foam wave soldering and manual dip soldering. Even printed circuit boards with average solderability or OSP treatment can achieve good soldering results, especially for lead-free processes.
The activity of the flux system is specially designed, in which the high solids content and its internal activity mechanism not only ensure that the board surface forms a uniform protective film after soldering, but also has extremely high surface insulation performance, so as to ensure the reliability of the electrical performance of the circuit board. At the same time, the welding of precision electronic devices also ensures excellent welding performance and effectively reduces the welding defect rate. In the absence of special requirements, the cleaning process can be eliminated, thereby saving the manufacturer's production costs, and there is a large range of process parameters to choose from, so that it can be adapted to different environments, different equipment and different application processes.
2、Scope of application
This series of fluxes is suitable for the soldering of PCB boards such as computer products, power supply products, communication products, televisions, audio equipment, household appliances, instruments and equipment, medical equipment, and new energy industries.
Applicable process: spray, adhesive coating, can be suitable for single-wave operation.
3. Product performance specifications
